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Second Call for Papers
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*** 14th Annual IEEE International ASIC/SOC Conference ***
*** "SOC in a Networked World" ***
*** Crystal City Hyatt Hotel, Washington, DC ***
*** September 12-15, 2001 ***
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Sponsored by IEEE Circuits and Systems Society
C A L L F O R P A P E R S
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Driven by the rapid growth of the Internet, communication technologies,
pervasive computing, and consumer electronics, Systems-on-Chip (SoC) have
started to become a key issue in today's electronic industry. The transition
from the traditional Application-Specific Integrated Circuit (ASIC) to SoC
has lead to new challenges in Design Methods, Automation, Manufacturing,
Technology, and Test.
The ASIC/SOC Conference provides a forum for sharing recent advances in
VLSI/ULSI/GSI technology and design capabilities, and their application to
meeting the engineering requirements for ASICs and SoCs. The 2001
Conference will offer three days of technical papers and a full day of
technical workshops. The best presented paper will be acknowledged by a
Best Paper Award. Papers are invited which address new and previously
unpublished developments in the following categories:
SoC Specific Design Methodologies Applications
--------------------------------- ------------
S1 Reusable & Embedded Cores/Macros, A1 Communication, Networking,
Memories Internet, e-Business
S2 Technology Independent Methodologies A2 Signal/Image Processing
S3 On-Chip Buses for SoC A3 Multimedia
S4 Smart Sensors Integration A4 Portable & Wireless Systems
S5 Library Development A5 Microprocessors, Computers
S6 Design of Reconfigurable SOCs Pervasive Computing
A6 Customer and Defense
Common Design Methodologies Electronics
--------------------------- A7 FPGAs and Reconfigurable SOCs
D1 High Performance, Low Power Design A8 Other SoC Applications
D2 Analog & Mixed-Signal Design
D3 Wireless Communications Design Enabling Technologies for SoC
D4 Digital Signal Processing -----------------------------
D5 Timing Methodologies, sync./async. T1 Embedded DRAMs/Flash Memories
design, clocking T2 Sensors/MEMS
D6 Reconfigurable/Scalable Design T3 Deep Sub-micron Technologies,
Cu, SiGe, SOI
Design Automation T4 Optical Interconnects
-----------------
DA1 System Interconnects, Interconnect Manufacturing
Modeling, Signal Integrity -------------
DA2 Hardware/Software Co-Design, M1 Signal Integrity & EMI
Verification M2 Packaging & I/O Interfacing
DA3 High Level Design & Synthesis M3 SoC Testing, Power Measurement,
DA4 Logic Design & Synthesis Burn-In
DA5 Physical Design & Synthesis, M4 SoC Fabrication Technologies
IP Issues and Reuse
DA6 SoC Specific CAD Tools Common SoC Issues
-----------------
Verification C1 Project Management, Distributed
------------ Development Teams
V1 Formal Verification C2 Intellectual Property,
V2 Simulation and Modeling Patent and Legal Issues
V3 Design for Testability, Fault C3 SoC Success Stories, Case
modeling, IDDQ Studies
V4 Failure Analysis C4 Future SoC Trends and Limits
C5 SOC Overview and Tutorial Papers
The paper must clearly state the advances proposed; therefore, sufficient
results (measured or simulated) and diagrams must be presented to demonstrate
the quality and originality of the contributed work. Submissions should clearly
indicate the category (S1...C5; see above), include a 25 word condensed abstract
(for publication in the Advance Program) and a full paper (limited to five double-
column IEEE format pages, including figures and references). Proposals for tutorial
papers, half-day and full-day tutorials/workshops, and for panel sessions are also
invited.
Send 3 copies of your paper, along with an electronic version (disk or CD-ROM)
in PDF format to : 2001 ASIC/SOC Conference, 101 Lakeforest Blvd., #400-B,
Gaithersburg, MD 20877, Fax: 301-527-0994, Email: wendyw@widerkehr.com. For
questions on technical issues please contact the appropriate chairperson listed
below.
DEADLINE FOR SUBMISSION: APRIL 13, 2001
NOTIFICATION OF ACCEPTANCE: MAY 25, 2001
FINAL CAMERA-READY PAPERS DUE: JUNE 30, 2001
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For paper submission and updated conference information, please visit our
web site at
http://asic.union.edu
or contact the ASIC/SOC Conference office at 301-527-0900 x104
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Conference General Chair Technical Program Chair
P.R. Mukund John Chickanosky
Rochester Institute of Technology IBM Microelectronics
prmeee@rit.edu chickano@us.ibm.com
Steering Committee Chair Publications/Publicity
Thomas Buechner Dong Ha
IBM Boeblingen Lab, Virginia Tech
tbuechner@de.ibm.com ha@vt.edu
Workshop Chair
Ram Krishnamurthy
Intel Corporation
ramk@hf.intel.com
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